The dopants are what make silicon an important component as a semiconductor
there is the insulating process where silicon dioxide is allowed to grow around the wafer. Consequently, a dopant is implanted to modify electric properties of the semi conductor. This is done with absolute care so as to add an accurate amount. The dopants are what make silicon an important component as a semiconductor. These dopants are added courtesy of photolithography ‘masking.’ To interconnect transistors, the products undergo metallization process. This last step is also the process that enhances the packaging of the component into the package leads. The whole wafer is then – if necessary – planarized by Chemical Mechanical Polishing (CMP), given a protective layer, and tested to ensure the circuits work as they should.5 The aforementioned processes represent the Front-End operation. In the back-End operation, four steps are involved: die preparation, die attachment, bonding and encapsulation. In the die preparation process, the wafer is diced into simple circuits. This is then attached to the support of the package before it is bonded to electric contacts. For protection purposes, encapsulation is done using plastic materials. For the sake of the end user, the component is tested before shipping. Vitally, the packaging is always done in tapes that have a number of pockets. The figure below shows the steps involved in the preparation and processing of a semiconductor.
